Title: Tong Hsing Electronic Industries, Ltd. | Contract Manufacturing for Microelectronic Packaging and Ceramic Thick Film / Thin Fil
Description: The world–renowned leading provider of micro module assembly and thick film and thin film substrate foundry services - Tong Hsing. Our strategic plan is to provide state-of-the-art microelectronic packaging and substrate technologies to various industr
Keywords:
DBC,
CMOS Image Sensor,
Image Sensor,
BSI wafer,
SiP,
MEMS assembling and test,
Power Module,
Microwave Module,
RF module,
and DPC on AlN for Thermoelectric Module,
CMOS Image Sensor Packaging,
MEMS Packaging,
SiP Packaging,
Thick Film,
Thin Film Substrates,
Automotive Hybrids,
PA and Front-end Modules